Improve productivity and reduce operative costs

Hot melt adhesives (HMA) are widely used in packaging applications like carton box closing, labels and tapes. Usually packaging cardboard boxes are assembled just before artifact packaging operation. Bonded closures undergo natural constraints of cardboard tending to unfold.

As a consequence, adhesives must be selected to develop higher cohesive strength. Futhermore, automatized packaging manufacture requires, fast development cohesive strength so as to improve productivity.

When packaging are sealed with tapes, high shear is an additional requirement to high cohesive strength.
Some advantages of formulating HMPSA for packaging application using Dynasol SBC's are:

* Wider tackifier resin compatibility.
* Low viscosity development
* Wide temperature range resistance
* Formulation versatility through a wide range of polymers
* Excelent product availavility
* Higher cohesive strength development capability

Key benefits by using Dynasol SBS copolymers in HMPSA for packaging application are set out below:

* Lower viscosity development
* Stronger adhesion
* Productivity improvement by reducing application temperature and set time.
* Operative costs reduction by low temperature operation.
* Superior Adhesive temperature performance.